by 3D integrated circuits (ICs) are a type of integrated circuits manufactured by stacking silicon wafers or dies and interconnecting them vertically using wafer-to-wafer, die-to-wafer or die-to-die stacking techniques. 3D ICs allow a much higher density of components and interconnects which results in faster circuits, more functionality and better energy savings compared to conventional printed circuit board-based 2D designs. The technology is currently used to stack memory chips in smartphones to reduce their thickness and improve performance. It is also finding increasing use in other IoT devices and edge computing applications where low power consumption and compact physical footprint are essential. With several industries rapidly adopting IoT solutions in manufacturing, healthcare and other sectors, the need for efficient 3D ICs is expected to surge in the coming years.
The global 3D ICs Market is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 12% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
Market Dynamics:
One of the major drivers propelling the growth of the 3D ICs market is the growing adoption of IoT devices which require advanced ICs for functionality. According to estimates, there will be over 21 billion IoT devices connecting people, processes and data by 2023. 3D IC technology enables fitting more transistors in less space which translates to powerful yet energy-efficient semiconductors for myriad IoT applications spanning industrial gateways, wearable devices and even tiny sensors. The ability to stack multiple dies carrying logic, memory and other components vertically leads to reduction in form factor and manufacturing costs. This makes 3D ICs highly suitable for rapid prototyping of advanced IoT technologies like autonomous vehicles, drones and AR/VR systems which demands flexible customization at lower development expenses. The strong focus on creating smart, connected systems will continue supporting uptake of 3D ICs globally in the coming years.
Segment Analysis
The Global 3D Ics Market Size is dominated by the memory sub-segment which accounts for around 50% share. 3D ICs are increasingly being utilized to integrate memory such as DRAM over logic ICs owing to their ability to significantly improve performance and reduce power consumption compared to conventional 2D packaging technology. The demand for more advanced memory integration is being driven by the rising requirements for bigger and faster memory in applications such as smartphones, computers, network devices and data centers.
PEST Analysis
Political: There is growing government support for the development of advanced semiconductor manufacturing capabilities. Various nations are introducing initiatives and funding for R&D to strengthen local chipmaking industry.
Economic: The strong growth in applications requiring high memory and computing power such as AI, VR/AR, autonomous vehicles is fueling investments in 3D IC technology by companies. The lower manufacturing costs achieved through 3D packaging is an added economic incentive.
Social: The rising digitalization of economies and consumer demand for powerful yet compact smart devices is creating pull for 3D ICs. Miniaturization helps in development of innovative form factors.
Technological: Advanced concepts like through-silicon vias (TSVs), monolithic 3D ICs and heterogeneous integration are helping overcome design challenges and improve performance metrics. Development of new interconnect and bonding technologies is further enhancing 3D ICs capabilities.
Key Takeaways
The global 3D ICs market is expected to witness high growth. The global 3D ICs Market is estimated to be valued at US$ 16937.26 million in 2023 and is expected to exhibit a CAGR of 12% over the forecast period 2023 to 2030.
The Asia Pacific region currently dominates the 3D ICs market with a share of over 40% owing to presence of large semiconductor foundries and manufacturers in countries like Taiwan, South Korea and China. The region is anticipated to continue its lead with biggest contributors to demand being smartphones, PCs and servers. North America is another major regional market propelled by chip development in the US. Europe is also growing significantly supported by R&D spending aimed at chip development self-reliance.
Key players related content comprises
Key players operating in the 3D ICs market are Aquahydrex, Inc., MAN Energy Solutions, Electrochaea GmbH, ITM Power PLC, EXYTRON GmbH, Hydrogenics Corporation, Hitachi Zosen Corporation. Among these, Aquahydrex, MAN Energy Solutions and Electrochaea GmbH are some of the leading players offering innovative 3D IC solutions targeting memory-centric and logic applications.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
